| Process Capability (2026.01) |
| Series |
Item |
Spec. |
| 1 |
Number of Layer |
Standard FR4 High TG |
1-80 L (>=10 L must use High TG) |
| 2 |
Product type |
ATE TEST Board |
EVB、WAT、MLO、Prboe Card、Load Board、Burn in Board、ESD、SLT |
| High Speed Board |
M9、M8、M7、M6 series |
| HDI |
1+N+1、 2+N+2、3+N+3、Any-layer HDI interconnection |
| High Frequency |
Rogers series 、Taconic series、Arlon series、Nelco series、F4BK、TP series |
| Rigid-flex |
≤20L |
| FPC |
≤10L |
| Special Process Technology |
Copper material 、AL material、Stepped slot / Step groove、Embedded resistor and capacitor (Embedded R/C)、Back drilling、Selective gold plating、POFV (Resin plug via)、Mixed lamination / Hybrid lamination |
| 3 |
Surface Treatment |
Surface Treatment |
HAL, HAL/LF, Enig, Immersion Silver, Immersion Tin, OSP, ENEPIG, Plating hard gold, Gold finger (contain segmented golden finger), Enig+OSP, Enig+gold finger, Immersion Tin+gold finger, Immersion Silver+gold finger、EPIG |
| 4 |
Board thickness |
Board thickness |
0.15-10.0mm |
| 5 |
T/H Ratio |
|
40:1 |
| 6 |
Size |
Max.Size |
610*864mm |
| 7 |
Finished Copper Thickness |
Outer Layers（max） |
30OZ |
| Inner Layers（max） |
10OZ |
| 8 |
Line width/space |
Min line width/space |
2.5/2.5mil |
