Rigid/HDI PCB
10-Layer Rigid
FR4 TG150+IS400 Material
ENIG 2U”+ Gold finger 20U”
Vias fill with resin
Press-fit holes
Paragraphing Gold finger
14-Layer HDI
ENIG 4U” Surface Treatment
Blind vias: L1-L2, L2-L3,
L14-L13, L13-L12
Buried holes: L3-L12
Vias fill with resin
8-Layer Rigid
FR4 370HR material
1.56mm Board Thickness
Semi-light green solder mask
Inner layer 2oz, Outer layer 4oz
Vias fill with resin
8-Layer HDI
S1000-2M+SF202 material
2.0mm Board Thickness
ENIG 2U” Surface treatment
Green solder mask
Blind holes: L8-L7
6-Layer Rigid
S1000-2M material
0.8mm Board Thickness
IC width 0.15mm
ENIG 2U” Surface treatment
Line width/space: 3.5/4mil
22-Layer Rigid
IT968 material
2.4mm Board Thickness
ENIG 2U” Surface treatment
Line width/space: 3/3mil
Green Soldermask
16-Layer Rigid
FR4 TG170 material
2.5mm Board Thickness
ENIG 2U” Surface treatment
Vias fill with Copper Paste
Asymmetric Copper
8-Layer HDI
FR4 TG180+ TU-862HF material
Blind Holes: L1-L2, L7-L8
Vias fill with resin,Buried Holes:L2-L3
Five kinds of Impedance control
Asymmetric Copper
