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What is Ultra-HDI? There is a lot of conversation about “Ultra-HDI” especially with all of the anticipated work being done as part of the CHIPS Act. In my experience, Ultra-HDI means different things to different people depending on where their capabilities and expertise are. IPC has created a working group to address ultra-HDI and their […]
In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer. Material thicknesses or what dielectrics are used is of less importance than which layers are dedicated to what, such as signal (SIG) layers, ground (GND) layers, or power (PWR) layers. Signal layers contain predominantly signal-carrying […]
Printed antennas are a very popular option for RF PCBs as they maintain the low profile of a planar device. If you look at some Bluetooth/WiFi capable MCUs, you will likely see an inverted-F antenna along the board edge to provide Rx and Tx in a compact form factor. In this article, I’ll show how […]